To disassemble remove screw hidden at microphone hole, bend steel backplate (4 latches), move backplate upwards.
Inside:
- SoC: Sigmatel STMP3504
- Toshiba TC58NVG3D4CTG00, see http://www.elnec.com/device/Toshiba/TC58NVG3D4CTG00+%5BTSOP48%5D/
- single chip, large block NAND, 3.3V operation, 8 Gbit, 2 bits/cell, organization: x8, 2kB / 256kB, 70 nm
- TEA5767 module (12 pin)
- ATL 422436 LiIon cell (3.7V, 3 wires)
No comments:
Post a Comment